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The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

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  • 1. State Key Laboratory of Structural Analysis for Industrial Equipment,Dalian University of Technology, Dalian 116024,Liaoning Province, P. R. China; 2. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics Chinese Academy of
    Sciences, Shanghai 200050, P. R. China; 3. College of Civil Engineering, Harbin Engineering University, Harbin 150001, P. R. China; 4. School of Engineering Systems, Faculty of Built Environment and Engineering,Queensland University of Technology, Brisbane, QLD
    4001, Australia

Received date: 2007-08-17

  Revised date: 2008-09-26

  Online published: 2008-11-01

Abstract

This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.

Cite this article

CAI Yan-hongCHEN Hao-ran;TANG Li-qiang;YAN Cheng;JIANG Wan . The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading[J]. Applied Mathematics and Mechanics, 2008 , 29(11) : 1517 -1526 . DOI: 10.1007/s10483-008-1112-z

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