Shanghai University
Article Information
- Youjiang CUI, Kaifa WANG, Baoling WANG
- Fracture mechanics analysis of delamination in a thermoelectric pn-junction sandwiched by an insulating layer
- Applied Mathematics and Mechanics (English Edition), 2018, 39(10): 1477-1484.
- http://dx.doi.org/10.1007/s10483-018-2379-8
Article History
- Received Jan. 22, 2018
- Revised May. 30, 2018
Due to the special ability in converting energy between heat and electricity, thermoelectric materials (TEMs) have many engineering applications, such as waste heat recovery[1], thermoelectric (TE) cooling[2] and thermal protection system in the aerospace industry[3]. However, the low conversion efficiency limits the development of TEMs. One available method to improve the conversion efficiency is to use multilayered TEMs[4]. Therefore, the study of multilayered TEMs becomes a research interest.
Extensive researches about multilayered TEMs have been carried out. For example, buckling of TEMs with a large length-to-thickness ratio was analyzed[5]. The buckling axial forces of thin-film TE generator made up of pn-junction were given[6]. The problem of axial thermal stress[7] and interlaminar thermal stress in layered TEMs[8] was studied. The conversion efficiency is a key parameter for TEMs. Energy conversion efficiency for TE devices made up of pn-junction with temperature dependent and independent electrical conductivity was analyzed[9]. Similarly, the efficiency of sandwiched TEMs with a graded interlayer whose properties vary with temperature was studied[10]. By taking the Peltier effect into account, the overall macro-performance of multilayered TEMs was discussed[11]. The effect of interface layers on the performance of annular TE generators was carried out[12].
Most TEMs are brittle in nature. Therefore, understanding their fracture properties is of great importance and will contribute to the development of multilayered TEMs[13-14]. However, because of the natures of non-homogeneity and poor interfacial shear strength, multilayered material systems are prone to damage by delamination[15]. The delamination may result in the loss of functionality of TE device. Therefore, mechanics (especially the fracture mechanics) research of multilayered TEMs is very important. However, fracture mechanics research of thermally induced delamination of multilayered TEMs has not yet been conducted.
The fracture mechanics analysis of delamination in a TE pn-junction sandwiched by an insulating layer was conducted. Time-varying energy release rates at the left and right tips of the delamination crack are given. The critical temperature difference that causes the delamination propagation is identified. Effects of temperature difference, electric current, and thickness of the insulating layer on the energy release rate are discussed.
2 Statement of the problemShown in Fig. 1 is a three-layer TEM which consists of an n-type TE layer and a p-type TE layer separated by an insulating layer. In the n-type TEM, the electric current is propagated by electrons. The charge carriers in the p-type TEM are holes which travel in the opposite direction with electrons[16]. The two TE layers have the same material properties and thickness h[5]. The thickness of the insulating layer is denoted by H. A through delamination crack occurs between the n-type layer and the insulating layer at the region l < x < l+a, where a is the length of the delamination crack. Expect that, for the region l < x < l+a, all layers are perfectly bonded together. The delamination part is replaced by equivalent axial forces FL and FR. The subscripts L and R denote the regions -C < x < l and l+a < x < C, respectively. The axial force of the delamination part is assumed to be uniform, which is presented by the distributed load χ. The electric potentials of the TEM of Fig. 1 are V=V0 at the left end x=-C and V=Vh at the right end x=C. The initial temperature of the entire system is T0, and the temperature at the right end is suddenly changed to Th (assume Th > T0 in this paper), where the subscripts h and 0 denote the hot end and the cold end of the TEM, respectively. This means that the left end and the right end of the TEM of Fig. 1 are subject to a combination of electric potential and temperature, respectively. Furthermore, the boundary conditions of the surfaces of delamination crack, the upper border
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Fig. 1 An equivalent model of delamination (color online) |
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Since the thickness of each layer is very small compared with its length, the heat flux and stress fields only vary along the length direction but are constant along the thickness and width directions of the system. Therefore, the problem is one-dimensional. The constitutive equations of the TEMs when there is no free electric charge and heat source are[8]
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(1) |
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(2) |
where J and q are the electric current density and heat flux, respectively, σ,
s, and k are, respectively, the electric conductivity, the Seebeck coefficient, and the heat conductivity of the TE layers in which i (i=N, P) indicate the n-type TE layer and the p-type TE layer, respectively. For the transient-state problem, the equilibrium equations are
The transient-state temperature field and axial force of multilayered TEMs without delamination crack were presented by Wang and Cui[8]. A brief review of the temperature field and axial force is given as follows. By taking Fourier's heat conduction, Joule's heat, and the energy accumulation into account, the following temperature governing equation of the multilayered TEMs is given:
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(3) |
By considering the energy balance and thermal boundary conditions (T=T0 at x=-C and T=Th at x=C), the effective transient temperature field of the TEMs is given as
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(4) |
where
The transient axial force FN(x, t) in the n-type layer is
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(5) |
where A=-a2C/sinh(ηC), B1=-(a1C2+a3)/cosh(ηC), B2=(-1)nCd1/cosh(ηC), a1=3γJ2/(2η2keqσ), a2=-γΔT/(η2C), a3=-γ(J2C2/(keqσ) +ΔT)/(2η2)+2a1/η2, d4=(2βnd1-γD1)/(η2+βn2), d1=γD1βn/(η2+βn2), η2=(λN+2λI)/(κI+κN), and γ =(αN-αI)/(κI+κN). αi (i=N, I) are the thermal expansion coefficients of the n-type layer and the insulating layer, respectively. λi and κi are the coefficients of axial and interfacial compliances, respectively, defined as λi=(1-υi)/(Eihi) and κi=2hi(1-υi)/(3Ei). υi, Ei, and hi are Poisson's ratio, Young's modulus, and the thickness, respectively.
Since the delamination crack is parallel to the direction of heat flux, the temperature field given by Eq. (4) will not be perturbed by the delamination crack. Therefore, we will use the temperature field given by Eq. (4) to study the transient axial forces FN*(x, t) and FI*(x, t). The superscript * denotes the state of the n-type layer delaminating from the insulating layer. Since the n-type layer and the p-type layer are symmetric with respect to x, the displacement and axial force in the two TE layers are the same. To obtain the solutions of transient axial force, we first present the axial displacements uN- (x) and uI+ (x). The superscripts -- and + denote, respectively, the displacement at the lower extreme fiber of the n-type layer and that at the upper extreme fiber of the insulating layer. The expressions of uN- (x) and uI+ (x) are given as follows[8]:
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(6a) |
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(6b) |
where τNI*(x, t) is the shear stress which acts at the interface between the n-type layer and the insulating layer. By making use of the force balance condition along the x-direction, one obtains 2FN*(x, t)+FI*(x, t)=0. Setting the displacement uN- (x) equal to uI (x) yields
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(7) |
Using the equation
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(8) |
where the subscript m=L, R, and
The equivalent axial forces FL and FR can be directly obtained by applying FL =FN (l, t) at x=l and FR =FN (l+a, t) at x=l+a in Eq. (5). Substitution of the mechanical boundary conditions x=-C, FN*(-C, t)=0 and x=l,
FN*(l, t)=FL into Eq. (8), respectively, the unknown coefficients
The energy release rate can be used as a criterion to judge whether the delamination propagates or not. Since the applied load is zero, the total potential energy equals the elastic strain energy U. The energy release rate
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(9) |
where AN and AI represent the cross areas of the n-type layer and the insulating layer, respectively. By using 2FN*(x)+FI*(x)=0, Eq. (9) can be rewritten as
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(10) |
Integrating Eq. (10) with respect to x at the interval [-C,
l+a] and [l+a, C], then substituting it into the equation
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(11a) |
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(11b) |
Equations (11a) and (11b) indicate that the energy release rates GL and GR are determined by the equivalent axial forces FL and FR. The equivalent axial forces can be evaluated by Eq. (5), in which the applied electric current density J is not coupled with the temperature difference ΔT across the system. Therefore, we can investigate the effect of J and ΔT on delamination energy release rates GL and GR separately.
5 Numerical results and discussionFor the purpose of numerical demonstration, the TE layer and the insulating layer are selected as the Bi2Te3 and the ceramic, respectively. The material properties used in this section are αN =1.68× 10-5 K, αI =0.65× 10-5 K, EN =47 GPa, EI =380 GPa, υN =0.4, υI=0.26, kN =2.2 W/(m·K), kI=17 W/(m·K), ρN =1.312× 106, ρI =3.176× 106, σN =1×105 Ω-1·m-1, and sN=200 μV/K[8]. The semi-length of the structure is C=150 μm. Unless otherwise specified, the TE layer and the insulating layer are assumed to have the same thickness h=H=3 μm. As presented in Eq. (8), the solution of axial force is given by the sum of an infinite series. All results in this section are for the truncation number 50, which has resulted in the convergent results. The delamination crack is assumed to be symmetric
In this section, the numerical model is verified by the finite element software ANSYS. The temperatures at the cold end and the hot end are, respectively, T0=290 K and Th=330 K. The electric potentials are prescribed as V0=0 at x=-C and Vh=0.01 V at x=C. For the one-dimensional problem, the electric current density J is a constant, which can be expressed as J=-σ (Vh-V0+sΔT)/(2C)=6× 106 A/m2[8]. For the typical delamination length a=10 μm, Fig. 2 illustrates the axial stress in the delamination region of the multilayered TEMs. Figure 2 indicates that the axial force in the delamination part is uniform.
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Fig. 2 Distributions of axial stress in the delamination crack region of multilayered TEMs (color online) |
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The crack tip intensity factor K at the left tip and the right tip of delamination crack is also analyzed in ANSYS. The relation between the crack intensity factor and the energy release rate for the case of plane stress is G=K2/E. For the typical length of delamination crack a=5 μm, 10 μm, and 30 μm, Table 1 lists the energy release rates from the numerical model and ANSYS. It can be seen that the numerical results agree well with the finite element results.
In this section, the applied electric current density is prescribed as J=0. Substituting J=0 into Eqs. (11a) and (11b) gives the delamination energy release rates GLT and GRT. The subscript T denotes the effect of temperature difference. To normalize delamination energy release rates GLT and GRT, we introduce a reference energy release rate G0T=(ΔTγ/η2)2(1/(ENh) +2/(EIH)). Figure 3 presents the effect of temperature difference ΔT on the normalized GLT and GRT. The solid curves denote the distributions of GLT. The dashed curves denote the distributions of GRT. It is found that the value of the energy release rate at the right tip of the delamination is larger than that at the left tip. Overall, the values of maximum GLT and GRT at the transient state are bigger than those of the steady state (e.g., t≥0.1 s). This identifies the significance of considering the transient state for the analysis of delamination of multilayered TE structures.
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Fig. 3 Effects of the temperature difference on the normalized GLT and GRT |
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In this section, the temperature difference is prescribed as ΔT=0. With substitution of ΔT=0 into Eqs. (11a) and (11b), one can obtain the delamination energy release rates GLJ and GRJ. The subscript J denotes the effect of electric current. The reference energy release rate G0J=(J2C2γ/(η2keqσ))2(1/(hEN) +2/(HEI)) is used to normalize GLJ and GRJ.
Figure 4 presents the effect of electric current on the delamination energy release rate. Again, the solid and dashed curves denote the energy release rates at the left and right tips of delamination crack, respectively. It is found that the value of maximum energy release rate decreases with time. The energy release rate at the right tip of delamination crack is larger than that at the left tip.
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Fig. 4 Effects of the applied electric current on the normalized GLJ and GRJ |
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Equation (3) clearly indicates that, though the constitutive equation of Eq. (1) is one-dimensional, the ratio of the insulating layer thickness to the TE layer thickness has a great effect on the distribution of temperature. As described in Section 4, the temperature greatly contributes to the distribution of G. This means that the thickness of insulating layer can affect the distribution of G. The thermal and electric boundary conditions applied at the TE system are the same as those of Subsection 5.1. For the typical time t=0.1 s, Fig. 5 presents the normalized GR for different values of insulating layer thickness H=30 μm, 3 μm, 0.6 μm, and 0.1 μm. The reference energy release rate is G0=h/(1/EN+2/EI). It is found that a thinner insulating layer results in a smaller GR. This means that the thickness of the insulating layer should be as thin as possible in engineering application.
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Fig. 5 Effect of the insulating layer thickness on the normalized GR |
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Since the delamination energy release rate at the right tip is bigger than that at the left tip, GR will be used to investigate the critical delamination temperature difference ΔTc. Based on the energy release rate criterion, the delamination crack will propagate when the expression GR ≥ Kc2/EI is satisfied, in which Kc is the interface fracture toughness between the p-type layer and the insulating layer. With the substitution of energy release rate given by Eq. (11b), one can obtain ΔTc. In this section, the value of Kc is chosen as 0.06 MPa· m1/2[17]. For the typical time t=0.1 s and the given fracture toughness Kc, Fig. 6 shows the critical delamination temperature difference for different thicknesses of the insulating layer. It can be seen that ΔTc decreases with the length of the delamination crack. For the same length of delamination crack, a thinner insulating layer results in a higher ΔTc.
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Fig. 6 Critical temperature difference of the delamination propagation |
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The fracture mechanics analysis of delamination in TE systems of the n-type layer and p-type layer separated by an insulating layer is carried out. The time-varying delamination energy release rate is given. Effects of the temperature difference, the applied electric current, and the thickness of insulating layer on the delamination energy release rate are discussed. The critical temperature difference of delamination propagation is explored by using an energy release rate criterion. It is found that the maximum delamination energy release rate of the transient state is bigger than that of the steady state. This suggests that considering the transient state when constructing the stability design of TE systems is essential. The thinner insulating layer results in the smaller delamination energy release rate and the higher critical delamination temperature difference. Therefore, the thickness of insulating layer should be as thin as possible in engineering applications.
[1] | ORR, B., AKBARZADEH, A., MOCHIZUKI, M., and SINGH, R. A review of car waste heat recovery systems utilizing thermoelectric generators and heat pipes. Applied Thermal Engineering, 101, 490-495 (2016) doi:10.1016/j.applthermaleng.2015.10.081 |
[2] | ZHAO, D. L. and TAN, G. A review of thermoelectric cooling:materials, modeling and applications. Applied Thermal Engineering, 66, 15-24 (2014) doi:10.1016/j.applthermaleng.2014.01.074 |
[3] | HAN, X. Y., WANG, J., and CHENG, H. F. Investigation of thermoelectric SiC ceramics for energy harvesting applications on supersonic vehicles leading-edges. Bulletin of Materials Science, 37(1), 127-132 (2014) doi:10.1007/s12034-014-0613-1 |
[4] | RAMOS, R., ANADÓN, A., LUCAS, I., UCHIDA, K., ALGARABEL, P. A., MORELLÓN, L., AGUIRRE, M. H., SAITOH, E., and IBARRA, M. R. Thermoelectric performance of spin seebeck effect in Fe3O4/Pt-based thin film heterostructures. APL Materials, 4(10), 104802 (2016) doi:10.1063/1.4950994 |
[5] | JIN, Z. H. Thermal stresses in a multilayered thin film thermoelectric structure. Microelectronics Reliability, 54, 1363-1368 (2014) doi:10.1016/j.microrel.2014.02.028 |
[6] | CUI, Y. J., WANG, B. L., and WANG, P. Analysis of thermally induced delamination and buckling of thin-film thermoelectric generators made up of pn-junctions. International Journal of Mechanical Science (2017) doi:10.1016/j.ijmecsci.2017.10.049 |
[7] | JIN, Z. H. Buckling of thin film thermoelectrics. International Journal of Fracture, 180(1), 129-136 (2013) doi:10.1007/s10704-012-9798-8 |
[8] | WANG, B. L. and CUI, Y. J. Transient interlaminar thermal stress in multi-layered thermoelectric materials. Applied Thermal Engineering, 119, 207-214 (2017) doi:10.1016/j.applthermaleng.2017.03.047 |
[9] | CHAVEZ, R., ANGST, S., HALL, J., STOETZEL, J., KESSLER, V., BITZER, L., MACULEWICZ, F., BENSON, N., WIGGERS, H., WOLF, D., SCHIERNING, G., and SCHMECHEL, R. High temperature thermoelectric device concept using large area pn junctions. Journal of Electronic Materials, 43(6), 2376-2383 (2014) doi:10.1007/s11664-014-3073-x |
[10] | WALLACE, T. T., JIN, Z. H., and SU, J. Efficiency of a sandwiched thermoelectric material with a graded interlayer and temperature-dependent properties. Journal of Electronic Materials, 45(4), 2142-2149 (2016) doi:10.1007/s11664-016-4358-z |
[11] | SONG, K., SONG, H. P., and GAO, C. F. Macro-performance of multilayered thermoelectric medium. Chinese Physics B, 26(12), 127307 (2017) doi:10.1088/1674-1056/26/12/127307 |
[12] | ZHANG, A. B., WANG, B. L., PANG, D. D., HE, L. W., LOU, J., WANG, J., and DU, J. K. Effect of interface layers on the performance of annular thermoelectric generators. Energy, 147, 612-620 (2018) doi:10.1016/j.energy.2018.01.098 |
[13] | WU, H. P., LI, L., CHAI, G. Z., SONG, F., and KITAMURA, T. Three-dimensional thermal weight function method for the interface crack problems in bimaterial structures under a transient thermal loading. Journal of Thermal Stresses, 39(4), 371-385 (2016) doi:10.1080/01495739.2016.1152108 |
[14] | ZHANG, A. B. and WANG, B. L. Temperature and electric potential fields of an interface crack in a layered thermoelectric or metal/thermoelectric material. International Journal of Thermal Science, 104, 396-403 (2016) doi:10.1016/j.ijthermalsci.2016.01.023 |
[15] | LOU, J., HE, L. W., DU, J. K., and WU, H. P. Buckling and post-buckling analyses of piezoelectric hybrid microplates subject to thermo-electro-mechanical loads based on the modified couple stress theory. Composite Structures, 153, 332-344 (2016) doi:10.1016/j.compstruct.2016.05.107 |
[16] | BELL, L. E. Cooling, heating, generating power and recovering waste heat with thermoelectric systems. Science, 321(5895), 1457-1461 (2008) doi:10.1126/science.1158899 |
[17] | LAMUTA, C., CUPOLILLO, A., POLITANO, A., ALIEV, Z. S., BABANLY, M. B., CHULKOV, E. V., and PAGNOTTA, L. Indentation fracture toughness of single-crystal Bi2Te3 topological insulators. Nano Research, 9(4), 1032-1042 (2016) doi:10.1007/s12274-016-0995-z |