Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials

doi:10.1007/s10483-014-1891-9

Applied Mathematics and Mechanics (English Edition) ›› 2014, Vol. 35 ›› Issue (10): 1261-1270.doi: https://doi.org/10.1007/s10483-014-1891-9

Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials

A. HASSAN¹, 宋天舒²

1. Department of Civil Engineering, Military Technical College, Cairo 11787, Egypt;
2. College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin 150001, P. R. China

收稿日期:2013-05-20 修回日期:2014-05-07 出版日期:2014-10-01 发布日期:2014-10-01
通讯作者: Tian-shu SONG, songts@126.com E-mail:songts@126.com
基金资助:
Project supported by the National Natural Science Foundation of China (No. 51108113)

Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials

A. HASSAN¹, Tian-su SONG²

1. Department of Civil Engineering, Military Technical College, Cairo 11787, Egypt;
2. College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin 150001, P. R. China

Received:2013-05-20 Revised:2014-05-07 Online:2014-10-01 Published:2014-10-01
Supported by:
Project supported by the National Natural Science Foundation of China (No. 51108113)

摘要/Abstract

摘要： The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric bi-materials model with two symmet- rically permeable interfacial cracks near the edges of a circular cavity, subjected to the dynamic incident anti-plane shearing wave (SH-wave). An available theoretical method to dynamic analysis in the related research field is provided. The formulations are based on Green's function method. The DSIFs at the inner and outer tips of the left crack are obtained by solving the boundary value problems with the conjunction and crack- simulation technique. The numerical results are obtained by the FORTRAN language program and plotted to show the influence of the variations of the physical parameters, the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs. Comparisons with previous work and between the inner and outer tips are con- cluded.

关键词: s function, dynamic anti-plane shearing wave (SH-wave), Green&rsquo, dynamic stress intensity factor (DSIF), symmetrically interfacial crack, piezoelectric bi-material

Abstract: The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric bi-materials model with two symmet- rically permeable interfacial cracks near the edges of a circular cavity, subjected to the dynamic incident anti-plane shearing wave (SH-wave). An available theoretical method to dynamic analysis in the related research field is provided. The formulations are based on Green's function method. The DSIFs at the inner and outer tips of the left crack are obtained by solving the boundary value problems with the conjunction and crack- simulation technique. The numerical results are obtained by the FORTRAN language program and plotted to show the influence of the variations of the physical parameters, the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs. Comparisons with previous work and between the inner and outer tips are con- cluded.

Key words: piezoelectric bi-material, symmetrically interfacial crack, dynamic anti-plane shearing wave (SH-wave), Green’s function, dynamic stress intensity factor (DSIF)

中图分类号:

O347.1

A. HASSAN;宋天舒. Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials[J]. Applied Mathematics and Mechanics (English Edition), 2014, 35(10): 1261-1270.

A. HASSAN;Tian-su SONG. Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials[J]. Applied Mathematics and Mechanics (English Edition), 2014, 35(10): 1261-1270.

参考文献

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Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials

Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials

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