Email Alert    RSS
Interfacial behavior of a thermoelectric film bonded to a graded substrate
Juan PENG, Dengke LI, Zaixing HUANG, Guangjian PENG, Peijian CHEN, Shaohua CHEN
Interfacial behavior of a thermoelectric film bonded to a graded substrate
Juan PENG, Dengke LI, Zaixing HUANG, Guangjian PENG, Peijian CHEN, Shaohua CHEN
Applied Mathematics and Mechanics (English Edition) . 2023, (11): 1853 -1870 .  DOI: 10.1007/s10483-023-3045-8

APS Journals | CSTAM Journals | AMS Journals | EMS Journals | ASME Journals
Total visitors:
Copyright © Applied Mathematics and Mechanics (English Edition)
Address：P. O. Box 122, Shanghai University, 99 Shangda Road, Shanghai 200444, China
E-mail： amm@department.shu.edu.cn
Technical support: Beijing Magtech Co.ltd support@magtech.com.cn