The classical Green’s functions used in the literature for a heat source in a homogeneous elastic medium cannot lead to finite remote thermal stresses in the medium, so that they may not work well in practical thermal stress analyses. In this paper, we develop a practical Green’s function for a heat source disposed eccentrically into an elastic disk/cylinder subject to plane deformation. The edge of the disk/cylinder is assumed to be thermally permeable and traction-free. The full thermal stress field induced by the heat source in the disk/cylinder is determined exactly and explicitly via the Cauchy integral techniques. In particular, a very simple formula is obtained to describe the hoop thermal stress on the edge of the disk/cylinder, which may be conveniently useful for analyzing the thermal stresses in microelectronic components.
Jian HUA, Ming DAI
. Practical Green’s function for the thermal stress field induced by a heat source in plane thermoelasticity[J]. Applied Mathematics and Mechanics, 2020
, 41(4)
: 543
-550
.
DOI: 10.1007/s10483-020-2597-8
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