Interfacial behavior of a thermoelectric film bonded to a graded substrate

Juan PENG, Dengke LI, Zaixing HUANG, Guangjian PENG, Peijian CHEN, Shaohua CHEN

doi:10.1007/s10483-023-3045-8

Applied Mathematics and Mechanics >

2023 , Vol. 44 >Issue 11: 1853 - 1870

DOI: https://doi.org/10.1007/s10483-023-3045-8

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Interfacial behavior of a thermoelectric film bonded to a graded substrate

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1. School of Materials Science and Physics, State Key Laboratory for Geomechanics and Deep Underground Engineering, School of Mechanics and Civil Engineering, China University of Mining and Technology, Xuzhou 221116, Jiangsu Province, China;
2. State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;
3. College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China;
4. State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China;
5. Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China;
6. Beijing Key Laboratory of Lightweight Multi-functional Composite Materials and Structures, Beijing Institute of Technology, Beijing 100081, China;
7. Collaborative Innovation Center of Electric Vehicles in Beijing, Beijing Institute of Technology, Beijing 100081, China

Received date: 2023-07-04

Revised date: 2023-08-20

Online published: 2023-10-26

Supported by

the National Natural Science Foundation of China (Nos. 11972363 and 12272401), the Opening Project of State Key Laboratory of Solid Lubrication (Lanzhou Institute of Chemical Physics) (No. LSL-20012001), and the Research Fund of State Key Laboratory of Mechanics and Control of Mechanical Structures (Nanjing University of Aeronautics and Astronautics) (No. MCMS-E-0221G01)

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Abstract

To improve the thermoelectric converting performance in applications such as power generation, reutilization of heat energy, refrigeration, and ultrasensitive sensors in scramjet engines, a thermoelectric film/substrate system is widely designed and applied, whose interfacial behavior dominates the strength and service life of thermoelectric devices. Herein, a theoretical model of a thermoelectric film bonded to a graded substrate is proposed. The interfacial shear stress, the normal stress in the thermoelectric film, and the stress intensity factors affected by various material and geometric parameters are comprehensively studied. It is found that adjusting the inhomogeneity parameter of the graded substrate, thermal conductivity, and current density of the thermoelectric film can reduce the risk of interfacial failure of the thermoelectric film/graded substrate system. Selecting a stiffer and thicker thermoelectric film is advantageous to the reliability of the thermoelectric film/graded substrate system. The results should be of great guiding significance for the present and upcoming applications of thermoelectric materials in various fields.

Key words： thermoelectric film; graded substrate; interfacial behavior; singular integral equation; shear stress intensity factor

Cite this article

Juan PENG, Dengke LI, Zaixing HUANG, Guangjian PENG, Peijian CHEN, Shaohua CHEN . Interfacial behavior of a thermoelectric film bonded to a graded substrate[J]. Applied Mathematics and Mechanics, 2023 , 44(11) : 1853 -1870 . DOI: 10.1007/s10483-023-3045-8

References

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