Applied Mathematics and Mechanics >
Vibration characteristic analysis of a cracked piezoelectric semiconductor curved beam
Received date: 2025-05-23
Revised date: 2025-08-11
Online published: 2025-09-30
Supported by
Project supported by the National Natural Science Foundation of China (No. 12272353), the Postdoctoral Research Grant in Henan Province of China (No. 202003091), and the Key Scientific Research Projects in Colleges and Universities of Henan Province of China (No. 22A130008)
Copyright
The fracture mechanics theory posits that cracks induce strain energy concentration near their tips in structural components, generating localized flexibility that impedes crack propagation. Theoretically, cracks are represented as dimensionless, massless spring models, effectively capturing crack characteristics and cross-sectional properties at the crack location. Leveraging this spring-based representation, this study establishes an open-crack model for a one-dimensional (1D) piezoelectric semiconductor (PSC) curved beam under dynamic loading. This model enables the investigation of vibration characteristics in cracked structures. The analytical solutions for the electromechanical fields of the beam are derived using the differential operator method, and the natural frequencies together with the corresponding generalized mode shapes of the beam are determined analytically. Furthermore, the effects of the crack parameters on the natural vibration characteristics of the PSC curved beam are analyzed.
Qiaoyun ZHANG , Xiaoyan ZHANG , Jiahao XU , Zhicai SONG , Minghao ZHAO . Vibration characteristic analysis of a cracked piezoelectric semiconductor curved beam[J]. Applied Mathematics and Mechanics, 2025 , 46(10) : 1967 -1982 . DOI: 10.1007/s10483-025-3307-6
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