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Applied Mathematics and Mechanics (English Edition) ›› 2008, Vol. 29 ›› Issue (11): 1517-1526 .doi: https://doi.org/10.1007/s10483-008-1112-z

• Articles • 上一篇    

剪切载荷作用下含损伤胶接材料界面动应力强度因子的研究

蔡艳红1,2;陈浩然1;唐立强3;闫澄4;江莞2   

  1. 1 大连理工大学 工业装备结构分析国家重点实验室， 大连 116024;
    2 哈尔滨工程大学 建筑工程学院， 哈尔滨 150001;
    3 昆士兰理工大学 环境与工程学部， Brisbane QLD 4001 Australia;
    4中国科学院上海硅酸盐研究所 高性能陶瓷和超微结构国家重点实验室，上海 200050
  • 收稿日期:2007-08-17 修回日期:2008-09-26 出版日期:2008-11-01 发布日期:2008-11-01
  • 通讯作者: 陈浩然

The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

CAI Yan-hong1,2;CHEN Hao-ran1;TANG Li-qiang3;YAN Cheng4;JIANG Wan2   

  1. 1. State Key Laboratory of Structural Analysis for Industrial Equipment,Dalian University of Technology, Dalian 116024,Liaoning Province, P. R. China; 2. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics Chinese Academy of
    Sciences, Shanghai 200050, P. R. China; 3. College of Civil Engineering, Harbin Engineering University, Harbin 150001, P. R. China; 4. School of Engineering Systems, Faculty of Built Environment and Engineering,Queensland University of Technology, Brisbane, QLD
    4001, Australia
  • Received:2007-08-17 Revised:2008-09-26 Online:2008-11-01 Published:2008-11-01
  • Contact: CHEN Hao-ran

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摘要： 本文主要针对剪切载荷作用下，胶接材料接合区域界面裂纹尖端动态应力强度因子进行了分析，其中考虑了裂尖区域的损伤。通过积分变换，引入位错密度函数，奇异积分方程被简化为代数方程，并采用配点法求解；最后经过Laplace逆变换，得到动态应力强度因子的时间响应。Ⅱ型动应力强度因子随着粘弹性胶层的剪切松弛参量、弹性基底的剪切模量和泊松比的增加而增大；随膨胀松弛参量的增加而减小。损伤屏蔽发生在裂纹扩展的起始阶段。裂纹尖端的奇异性指数是与材料的物理参数、损伤程度和时间无关的，-0.5，而振荡指数由粘弹性材料参数控制。

关键词: 动态应力强度因子, 界面裂纹, 胶接材料, 损伤, 奇异积分方程

Abstract: This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.

Key words: dynamic stress intensity factor, interface crack, adhesively bonded material, damage, singular integral equation

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