Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate

doi:10.1007/s10483-020-2671-7

Applied Mathematics and Mechanics (English Edition) ›› 2020, Vol. 41 ›› Issue (11): 1599-1610.doi: https://doi.org/10.1007/s10483-020-2671-7

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Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate

Yingli SHI^1,2,3, Junyun JI⁴, Yafei YIN¹, Yuhang LI^1,5, Yufeng XING¹

1. Institute of Solid Mechanics, Beihang University, Beijing 100191, China;
2. BOE Technology Group Company Limited, Beijing 100176, China;
3. University Electronic Science and Technology China, State Key Laboratory of Electronic Thin Films and Integrated Device, Chengdu 610054, China;
4. Institute of Structure and Environment Engineering, Beijing 100076, China;
5. State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, Liaoning Province, China

收稿日期:2020-06-27 修回日期:2020-07-25 出版日期:2020-11-01 发布日期:2020-10-24
通讯作者: Yuhang LI E-mail:liyuhang@buaa.edu.cn
基金资助:
Project supported by the National Natural Science Foundation of China (No. 11772030), the Aeronautical Science Foundation of China (No. 2018ZC51030), and the Opening fund of State Key Laboratory of Structural Analysis for Industrial Equipment of Dalian University of Technology (No. GZ19117)

Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate

Yingli SHI^1,2,3, Junyun JI⁴, Yafei YIN¹, Yuhang LI^1,5, Yufeng XING¹

1. Institute of Solid Mechanics, Beihang University, Beijing 100191, China;
2. BOE Technology Group Company Limited, Beijing 100176, China;
3. University Electronic Science and Technology China, State Key Laboratory of Electronic Thin Films and Integrated Device, Chengdu 610054, China;
4. Institute of Structure and Environment Engineering, Beijing 100076, China;
5. State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, Liaoning Province, China

Received:2020-06-27 Revised:2020-07-25 Online:2020-11-01 Published:2020-10-24
Contact: Yuhang LI E-mail:liyuhang@buaa.edu.cn
Supported by:
Project supported by the National Natural Science Foundation of China (No. 11772030), the Aeronautical Science Foundation of China (No. 2018ZC51030), and the Opening fund of State Key Laboratory of Structural Analysis for Industrial Equipment of Dalian University of Technology (No. GZ19117)

摘要/Abstract

摘要： As thermal protection substrates for wearable electronics, functional soft composites made of polymer materials embedded with phase change materials and metal layers demonstrate unique capabilities for the thermal protection of human skin. Here, we develop an analytical transient phase change heat transfer model to investigate the thermal performance of a wearable electronic device with a thermal protection substrate. The model is validated by experiments and the finite element analysis (FEA). The effects of the substrate structure size and heat source power input on the temperature management efficiency are investigated systematically and comprehensively. The results show that the objective of thermal management for wearable electronics is achieved by the following thermal protection mechanism. The metal thin film helps to dissipate heat along the in-plane direction by reconfiguring the direction of heat flow, while the phase change material assimilates excessive heat. These results will not only promote the fundamental understanding of the thermal properties of wearable electronics incorporating thermal protection substrates, but also facilitate the rational design of thermal protection substrates for wearable electronics.

关键词: wearable electronics, functional composite, theoretical heat transfer analysis, thermal management

Abstract: As thermal protection substrates for wearable electronics, functional soft composites made of polymer materials embedded with phase change materials and metal layers demonstrate unique capabilities for the thermal protection of human skin. Here, we develop an analytical transient phase change heat transfer model to investigate the thermal performance of a wearable electronic device with a thermal protection substrate. The model is validated by experiments and the finite element analysis (FEA). The effects of the substrate structure size and heat source power input on the temperature management efficiency are investigated systematically and comprehensively. The results show that the objective of thermal management for wearable electronics is achieved by the following thermal protection mechanism. The metal thin film helps to dissipate heat along the in-plane direction by reconfiguring the direction of heat flow, while the phase change material assimilates excessive heat. These results will not only promote the fundamental understanding of the thermal properties of wearable electronics incorporating thermal protection substrates, but also facilitate the rational design of thermal protection substrates for wearable electronics.

Key words: wearable electronics, functional composite, theoretical heat transfer analysis, thermal management

中图分类号:

Yingli SHI, Junyun JI, Yafei YIN, Yuhang LI, Yufeng XING. Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate[J]. Applied Mathematics and Mechanics (English Edition), 2020, 41(11): 1599-1610.

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Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate

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