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ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES
刘玉岚;王彪;王殿富
ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES
LIU Yu-lan;WANG Biao;WANG Dian-fu
Applied Mathematics and Mechanics (English Edition) . 2003, (2): 153 -162 . 

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