ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES

Applied Mathematics and Mechanics (English Edition) ›› 2003, Vol. 24 ›› Issue (2): 153-162.

ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES

刘玉岚, 王彪, 王殿富

Research Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, P.R.China

收稿日期:2001-08-20 修回日期:2002-06-04 出版日期:2003-02-18 发布日期:2003-02-18
通讯作者: WANG Biao

ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES

LIU Yu-lan, WANG Biao, WANG Dian-fu

Research Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, P.R.China

Received:2001-08-20 Revised:2002-06-04 Online:2003-02-18 Published:2003-02-18

摘要/Abstract

摘要： Due to the mismatch in the coefficients of thermal expansion of slicon chip and the surrounding plastic encapsulation materials, the induced thermal stress is the main cause for die and encapsulant rupture. The corner geometry is simplified as the semi-infinite wedge. Then the two-dimensional thermal stress distribution around the corner was obtained explicitly. Based on the stress calculation, the strain energy density factor criterion is used to evaluate the strength of the structure, which can not only give the critical condition for the stresses, but also determine the direction of fracture initiation around the corner.

Abstract: Due to the mismatch in the coefficients of thermal expansion of slicon chip and the surrounding plastic encapsulation materials, the induced thermal stress is the main cause for die and encapsulant rupture. The corner geometry is simplified as the semi-infinite wedge. Then the two-dimensional thermal stress distribution around the corner was obtained explicitly. Based on the stress calculation, the strain energy density factor criterion is used to evaluate the strength of the structure, which can not only give the critical condition for the stresses, but also determine the direction of fracture initiation around the corner.

中图分类号:

刘玉岚;王彪;王殿富. ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES[J]. Applied Mathematics and Mechanics (English Edition), 2003, 24(2): 153-162.

LIU Yu-lan;WANG Biao;WANG Dian-fu . ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES[J]. Applied Mathematics and Mechanics (English Edition), 2003, 24(2): 153-162.

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ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES

ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES

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