Applied Mathematics and Mechanics (English Edition) ›› 2003, Vol. 24 ›› Issue (2): 153-162.
刘玉岚, 王彪, 王殿富
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RSS收稿日期:2001-08-20
修回日期:2002-06-04
出版日期:2003-02-18
发布日期:2003-02-18
通讯作者:
WANG Biao
LIU Yu-lan, WANG Biao, WANG Dian-fu
Received:2001-08-20
Revised:2002-06-04
Online:2003-02-18
Published:2003-02-18
摘要： Due to the mismatch in the coefficients of thermal expansion of slicon chip and the surrounding plastic encapsulation materials, the induced thermal stress is the main cause for die and encapsulant rupture. The corner geometry is simplified as the semi-infinite wedge. Then the two-dimensional thermal stress distribution around the corner was obtained explicitly. Based on the stress calculation, the strain energy density factor criterion is used to evaluate the strength of the structure, which can not only give the critical condition for the stresses, but also determine the direction of fracture initiation around the corner.
中图分类号:
刘玉岚;王彪;王殿富. ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES[J]. Applied Mathematics and Mechanics (English Edition), 2003, 24(2): 153-162.
LIU Yu-lan;WANG Biao;WANG Dian-fu . ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES[J]. Applied Mathematics and Mechanics (English Edition), 2003, 24(2): 153-162.
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