ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES

Abstract

2010 MSC Number:

LIU Yu-lan;WANG Biao;WANG Dian-fu . ANALYTICAL SOLUTIONS OF THERMAL STRESS DISTRIBUTION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT PACKAGES. Applied Mathematics and Mechanics (English Edition), 2003, 24(2): 153-162.

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References

[1] Bar-Cohen A. State-of the art and trends in the thermal packaging of electronic equipment[J]. ASME Journal of Electronic Packaging, 1992,114(9): 257-270.
[2] Nguyen L T, Chen A S, Lo R Y. Interfacial integrity in electronic packaging[J].Application of Fracture Mechanics in Electronic Packaging and Materials, 1995, EEP-11/MD-64, ASME (12-17):35-44.
[3] Holalkere V, Mirano S, Kuo A Y, et al. Evaluation of plastic package delamination via reliability testing and fracture mechanics approach[A]. In: Proceedings of the 47 th Electronic Components & Technology Conference [C]. San Jose, California, 1997,430-437.
[4] Lau J H, Pao Y H. Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Patch SMT Assemblies [M]. New York NY: McGraw-Hill, 1997,87-99.
[5] Pendse R, Demmin J. Test structures and finite element models for chip stress and plastic package reliability[A]. In: Proceedings of IEEE Conference on Microelectronic Test Structures [C].Electron Devices Society Staff, Institute of Electrical and Electronics Engineers, Inc Staff, 1990,155-161.
[6] Nguyen L T, Gee S A, Bogert W F. Effect of configuration on plastic packages stresses[J]. ASME Journal of Electronic Packaging, 1993,115(4): 397-405.
[7] Shook R L, Sastry V S. Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC' s[A]. In: Proceedings of the 47th Electronic Components & Technology Conference [C]. San Jose, California, 1997,1041-1058.
[8] Zhu J, Zou D, Liu S. High temperature deformation of area array packages by moire interferometry/ FEM hybrid method [A]. In: Proceedings of the 47th Electronic Conponents& Technolgy Conference [C]. San Jose, California, 1997, 444-451.
[9] Clark J D, Megregor I J. Ultimate tensile stress over a zone: A new failure criterion for adhesive joints[J]. The Journal of Adhesion, 1993,42(4):227-245.
[10] Hu J M. Interfacial stress singularity analysis: A case study for plastic encapsulated IC packages[J]. Application of Fracture Mechanics in Electronic Packaging and Materials, 1995, ASME EEP-11/MD-64:13-21.
[11] Hattori T, Sakata S, Murakami G. A stress singularity parameter approach for evaluating the interfacial reliability of plastic encapsulated LSI devices [J]. ASME Journal of Electronic Packaging, 1989,111 (4): 242-253.
[12] Sih G C. Some basic problems in fracture mechanics and new concepts[J]. Engineering Fracture Mechanics, 1973,5 (2): 365-377.
[13] Sih G C. Engrgy-density concept in fracture mechanics[J]. Engineering Fracture Mechanics, 1973, 5(9): 1037-1051.
[14] Sih G C. Strain-energy-density factor applied to mixed mode crack problems[J]. International Journal of Fracture, 1974,10(3):305-321.
[15] Gdoutos E E. Fracture Mechanics Criteria and Applications[M].Evanston,IL: Kluwer Academic Publishers, Northwestern University, 1990,57-75.