Thickness-averaged model for numerical simulation of electroosmotic flow in three-dimensional microfluidic chips
Bo CHEN1, Han CHEN1, Jian-kang WU2
1. School of Civil Engineering and Mechanics, Huazhong University of Science and Technology, Wuhan 430074, P. R. China;
2. Wenhua Institute, Huazhong University of Science and Technology, Wuhan 430074, P. R. China
Bo CHEN;Han CHEN;Jian-kang WU. Thickness-averaged model for numerical simulation of electroosmotic flow in three-dimensional microfluidic chips. Applied Mathematics and Mechanics (English Edition), 2013, 34(3): 297-308.