| [1] |
Jing PENG, Hui FENG, Hong WU, Jia LI, Qihong FANG.
Decoupling strength-damage trade-offs in additively manufactured alloys via engineered strain gradient
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(5): 1041-1064.
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| [2] |
Cai REN, Kaifa WANG, Baolin WANG.
Electro-mechanical-carrier coupling model in fractured piezoelectric semiconductor strip with vertical cracks
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(2): 347-368.
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| [3] |
Huameng WANG, Zhangna XUE, Jianlin LIU, Z. T. CHEN.
Size effect on the thermal fracture behavior of collinear interface cracks in functionally graded coating/substrate structures
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(2): 325-346.
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| [4] |
Zibo WEI, Peijun WEI, Chunyu XU, Xiao GUO.
Dispersion, attenuation, and bandgap of in-plane coupled Bloch waves in piezoelectric semiconductor phononic crystal with PN junction
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(5): 813-830.
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| [5] |
Zhangna XUE, Huameng WANG, Jianlin LIU, Minjie WEN, Z. T. CHEN.
Thermal fracture analysis of two collinear cracks in a functionally graded medium based on the three-phase-lag model
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(3): 501-520.
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| [6] |
Jinjian XIE, Zhaoxia ZHANG, Pengpeng SHI, Xiaofan GOU.
Analytical solution for the fracture problem in superconducting tapes with oblique cracks under the electromagnetic force
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(3): 485-500.
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| [7] |
Qiaoyun ZHANG, Xiaoyan ZHANG, Jiahao XU, Zhicai SONG, Minghao ZHAO.
Vibration characteristic analysis of a cracked piezoelectric semiconductor curved beam
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(10): 1967-1982.
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| [8] |
Dianwu HUANG, Linghui HE.
A theory for three-dimensional response of micropolar plates
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(8): 1403-1414.
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| [9] |
Xiaoyang SU, Tong HU, Wei ZHANG, Houjun KANG, Yunyue CONG, Quan YUAN.
Transfer matrix method for free and forced vibrations of multi-level functionally graded material stepped beams with different boundary conditions
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(6): 983-1000.
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| [10] |
Dan ZHANG, Liangping YI, Zhaozhong YANG, Jingqiang ZHANG, Gang CHEN, Ruoyu YANG, Xiaogang LI.
A phase-field model for simulating the propagation behavior of mixed-mode cracks during the hydraulic fracturing process in fractured reservoirs
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(5): 911-930.
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| [11] |
Junsong HU, Baoling WANG, Yang YANG, Dong XIE.
Non-Fourier heat conduction induced thermal shock fracture behavior of multi-crack auxetic honeycomb structures
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(12): 2093-2112.
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| [12] |
Jing ZHANG, Guanting LIU.
A Dugdale-Barenblatt model for elliptical orifice problem with asymmetric cracks in one-dimensional orthorhombic quasicrystals
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(9): 1533-1546.
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| [13] |
M. KIM, G. LIN.
Peri-Net-Pro: the neural processes with quantified uncertainty for crack patterns
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(7): 1085-1100.
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| [14] |
Siyong LIU, Yuanzhi XU, Richeng LIAO, Ge HE, Li DING, Bingbing AN, Dongsheng ZHANG.
On fracture behavior of inner enamel: a numerical study
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(6): 931-940.
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| [15] |
Jian CHEN, Yawei WANG, Xianfang LI.
Antiplane shear crack in a prestressed elastic medium based on the couple stress theory
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(4): 583-602.
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