Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

doi:10.1007/s10483-023-2989-7

Abstract

Abstract: In this paper, we investigate the interfacial behavior of a thin one-dimensional (1D) hexagonal quasicrystal (QC) film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation. The contact interface is assumed to be non-slipping, with both perfectly bonded and debonded boundary conditions. The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress, which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials. The expressions are explicitly obtained for the phonon interfacial shear stress, internal normal stress, and stress intensity factors (SIFs). Finally, based on numerical calculations, we briefly discuss the effects of the material mismatch, the geometry of the QC film, and the debonded length and location on stresses and SIFs.

Key words: one-dimensional (1D) hexagonal quasicrystal (QC) film, stress intensity factor (SIF), thermal variation, Chebyshev polynomial, interfacial behavior

2010 MSC Number:

Huayang DANG, Dongpei QI, Minghao ZHAO, Cuiying FAN, C.S. LU. Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film. Applied Mathematics and Mechanics (English Edition), 2023, 44(5): 841-856.

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