| [1] |
Jing PENG, Hui FENG, Hong WU, Jia LI, Qihong FANG.
Decoupling strength-damage trade-offs in additively manufactured alloys via engineered strain gradient
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(5): 1041-1064.
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| [2] |
Cai REN, Kaifa WANG, Baolin WANG.
Electro-mechanical-carrier coupling model in fractured piezoelectric semiconductor strip with vertical cracks
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(2): 347-368.
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| [3] |
Huameng WANG, Zhangna XUE, Jianlin LIU, Z. T. CHEN.
Size effect on the thermal fracture behavior of collinear interface cracks in functionally graded coating/substrate structures
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(2): 325-346.
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| [4] |
Zhangna XUE, Huameng WANG, Jianlin LIU, Minjie WEN, Z. T. CHEN.
Thermal fracture analysis of two collinear cracks in a functionally graded medium based on the three-phase-lag model
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(3): 501-520.
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| [5] |
Jinjian XIE, Zhaoxia ZHANG, Pengpeng SHI, Xiaofan GOU.
Analytical solution for the fracture problem in superconducting tapes with oblique cracks under the electromagnetic force
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(3): 485-500.
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| [6] |
Kai LUO, Cuiying FAN, Minghao ZHAO, C. S. LU, Huayang DANG.
Interfacial analysis of a penny-shaped one-dimensional hexagonal functionally graded piezoelectric quasicrystal film on a temperature-dependent substrate
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(12): 2297-2316.
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| [7] |
Qiaoyun ZHANG, Xiaoyan ZHANG, Jiahao XU, Zhicai SONG, Minghao ZHAO.
Vibration characteristic analysis of a cracked piezoelectric semiconductor curved beam
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(10): 1967-1982.
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| [8] |
K. CHANDAN, K. KARTHIK, K. V. NAGARAJA, B. C. PRASANNAKUMARA, R. S. VARUN KUMAR, T. MUHAMMAD.
Radiative heat transfer analysis of a concave porous fin under the local thermal non-equilibrium condition: application of the clique polynomial method and physics-informed neural networks
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(9): 1613-1632.
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| [9] |
Zhenliang HU, Xueyang ZHANG, Xianfang LI.
Bending strength degradation of a cantilever plate with surface energy due to partial debonding at the clamped boundary
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(9): 1573-1594.
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| [10] |
Wei LU, Shuo CHEN, Zhiyuan YU, Jiayi ZHAO.
Simulation of nanofluid natural convection based on single-particle hydrodynamics in energy-conserving dissipative particle dynamics (eDPD)
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(8): 1429-1446.
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| [11] |
Dan ZHANG, Liangping YI, Zhaozhong YANG, Jingqiang ZHANG, Gang CHEN, Ruoyu YANG, Xiaogang LI.
A phase-field model for simulating the propagation behavior of mixed-mode cracks during the hydraulic fracturing process in fractured reservoirs
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(5): 911-930.
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| [12] |
Shijing GAO, Lele ZHANG, Jinxi LIU, Guoquan NIE, Weiqiu CHEN.
Indentation behavior of a semi-infinite piezoelectric semiconductor under a rigid flat-ended cylindrical indenter
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(4): 649-662.
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| [13] |
Junsong HU, Baoling WANG, Yang YANG, Dong XIE.
Non-Fourier heat conduction induced thermal shock fracture behavior of multi-crack auxetic honeycomb structures
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(12): 2093-2112.
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| [14] |
Yu ZHANG, Daming NIE, Xuyao MAO, Li LI.
A thermodynamics-consistent spatiotemporally-nonlocal model for microstructure-dependent heat conduction
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(11): 1929-1948.
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| [15] |
S. I. ABDELSALAM, A. Z. ZAHER.
Biomimetic amelioration of zirconium nanoparticles on a rigid substrate over viscous slime—a physiological approach
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(9): 1563-1576.
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