| [1] |
Cai REN, Kaifa WANG, Baolin WANG.
Electro-mechanical-carrier coupling model in fractured piezoelectric semiconductor strip with vertical cracks
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(2): 347-368.
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| [2] |
Huameng WANG, Zhangna XUE, Jianlin LIU, Z. T. CHEN.
Size effect on the thermal fracture behavior of collinear interface cracks in functionally graded coating/substrate structures
[J]. Applied Mathematics and Mechanics (English Edition), 2026, 47(2): 325-346.
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| [3] |
Zhangna XUE, Huameng WANG, Jianlin LIU, Minjie WEN, Z. T. CHEN.
Thermal fracture analysis of two collinear cracks in a functionally graded medium based on the three-phase-lag model
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(3): 501-520.
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| [4] |
Jinjian XIE, Zhaoxia ZHANG, Pengpeng SHI, Xiaofan GOU.
Analytical solution for the fracture problem in superconducting tapes with oblique cracks under the electromagnetic force
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(3): 485-500.
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| [5] |
Kai LUO, Cuiying FAN, Minghao ZHAO, C. S. LU, Huayang DANG.
Interfacial analysis of a penny-shaped one-dimensional hexagonal functionally graded piezoelectric quasicrystal film on a temperature-dependent substrate
[J]. Applied Mathematics and Mechanics (English Edition), 2025, 46(12): 2297-2316.
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| [6] |
Zhenliang HU, Xueyang ZHANG, Xianfang LI.
Bending strength degradation of a cantilever plate with surface energy due to partial debonding at the clamped boundary
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(9): 1573-1594.
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| [7] |
Shijing GAO, Lele ZHANG, Jinxi LIU, Guoquan NIE, Weiqiu CHEN.
Indentation behavior of a semi-infinite piezoelectric semiconductor under a rigid flat-ended cylindrical indenter
[J]. Applied Mathematics and Mechanics (English Edition), 2024, 45(4): 649-662.
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| [8] |
Huayang DANG, Dongpei QI, Minghao ZHAO, Cuiying FAN, C.S. LU.
Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(5): 841-856.
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| [9] |
Yansong WANG, Baolin WANG, Youjiang CUI, Kaifa WANG.
Anti-plane pull-out of a rigid line inclusion from an elastic medium
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(5): 809-822.
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| [10] |
Jian CHEN, Yawei WANG, Xianfang LI.
Antiplane shear crack in a prestressed elastic medium based on the couple stress theory
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(4): 583-602.
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| [11] |
Chenxue JIA, Zihao WANG, Donghui ZHANG, Taihua ZHANG, Xianhong MENG.
Fracture of films caused by uniaxial tensions: a numerical model
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(12): 2093-2108.
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| [12] |
Juan PENG, Dengke LI, Zaixing HUANG, Guangjian PENG, Peijian CHEN, Shaohua CHEN.
Interfacial behavior of a thermoelectric film bonded to a graded substrate
[J]. Applied Mathematics and Mechanics (English Edition), 2023, 44(11): 1853-1870.
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| [13] |
Xin ZHANG, Minghao ZHAO, Cuiying FAN, C. S. LU, Huayang DANG.
Three-dimensional interfacial fracture analysis of a one-dimensional hexagonal quasicrystal coating
[J]. Applied Mathematics and Mechanics (English Edition), 2022, 43(12): 1901-1920.
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| [14] |
Minghao ZHAO, Cuiying FAN, C. S. LU, Huayang DANG.
Interfacial fracture analysis for a two-dimensional decagonal quasi-crystal coating layer structure
[J]. Applied Mathematics and Mechanics (English Edition), 2021, 42(11): 1633-1648.
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| [15] |
Xing ZHAO, Zhenghua QIAN, Jinxi LIU, Cunfa GAO.
Effects of electric/magnetic impact on the transient fracture of interface crack in piezoelectric-piezomagnetic sandwich structure: anti-plane case
[J]. Applied Mathematics and Mechanics (English Edition), 2020, 41(1): 139-156.
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